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Intel and 3DGS to Set Up Advanced Semiconductor Glass Core Packaging Facility in Odisha

Yajati Rout by Yajati Rout
May 29, 2026
in Odisha, Tech, Trending Now
Reading Time: 4 mins read
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Odisha Intel 3DGS semiconductor facility
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In a landmark move that could reshape Eastern India’s technological landscape, the Government of Odisha announced today that Intel Corporation and 3D Glass Solutions (3DGS) have signed an MoU to explore establishing a state-of-the-art semiconductor glass core packaging substrate manufacturing facility in the state.


If realised, the project would rank among the largest technology investments in the region and position Odisha as a rising global hub for semiconductor manufacturing, advanced packaging, AI infrastructure, next-generation data centres, and digital technologies.

A Transformative Collaboration

The proposed facility would leverage 3DGS’s pioneering glass-core substrate technology and Intel Foundry’s expertise to accelerate next-generation advanced packaging solutions critical for artificial intelligence, high-performance computing, and high-end electronics. 

Babu Mandava, CEO of 3D Glass Solutions, expressed enthusiasm: “We are grateful for the strong support of the Government of Odisha and excited about our collaboration with Intel. This initiative has the potential to establish India as a key global hub for advanced glass substrates and semiconductor packaging.”

Mr. Naga Chandrasekaran, Executive Vice President and General Manager of Intel Foundry, added: “As a pioneer in glass core substrate technology, we are excited about the potential of this collaboration to accelerate the commercialisation of next-generation advanced packaging solutions globally.”

Strong Policy Backing and Vision

Odisha’s Chief Secretary Anu Garg described the MoU as “a transformative step in Odisha’s journey towards becoming a key player in advanced semiconductor and electronics manufacturing.”

Dr. Mukesh Mahaling, Minister for Electronics and IT, emphasised job creation and inclusive growth, while Union Minister Ashwini Vaishnaw noted that the project aligns with India’s broader goal of strengthening domestic manufacturing capabilities.

Chief Minister of Odisha captured the excitement best: “This is a transformational, generational opportunity that will accelerate economic growth, strengthen India’s technological self-reliance, and position Odisha at the forefront of the global digital economy.”

The initiative is closely aligned with Odisha Vision 2036 and the national Atmanirbhar Bharat agenda, aiming to build a vibrant ecosystem of innovation, talent, and infrastructure.

The Government of Odisha has extended an open invitation to global technology companies, research institutions, and ecosystem partners to join this ambitious journey.


 

Tags: 3D Glass Solutionsadvanced packagingAI infrastructureAtmanirbhar BharatGlass Core SubstrateIndia Semiconductor MissionIntel IndiaOdisha ElectronicsOdisha Intel 3DGS semiconductor facilityOdisha semiconductorsemiconductor manufacturing
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Yajati Rout

Yajati Rout

Yajati K. Rout is a dynamic journalist at Pragativadi, known for delivering nuanced and impactful storytelling that spans Odisha’s societal fabric to global sports arenas. His reporting navigates seamlessly between grassroots realities, high-profile political developments, and the pulse of international tennis and cricket. With a flair for SEO-driven storytelling and a deep cultural lens, Yajati crafts content that resonates with a diverse readership—bridging insight with accessibility.

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