In a landmark development for Odisha’s tech landscape, the Union Cabinet has approved two major semiconductor manufacturing projects in Bhubaneswar under the India Semiconductor Mission (ISM).
With a combined investment of ₹4,600 crore across four states, Odisha stands out as the only state to host both a compound semiconductor fab and an advanced packaging unit.
SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish an integrated facility for Silicon Carbide (SiC) based compound semiconductors in Info Valley, Bhubaneshwar, Odisha. This will be the first commercial compound semiconductor fabrication plant in the country. The project aims to manufacture Silicon Carbide devices with an annual capacity of 60,000 wafers and packaging capacity for 96 million units. The proposed products will be applicable in various industries, including missiles, defence equipment, electric vehicles (EVs), railways, fast chargers, data centre racks, consumer appliances, and solar power inverters.
Additionally, 3D Glass Solutions Inc. will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will introduce the world’s most advanced packaging technology to India, enhancing efficiency within the semiconductor industry. The facility will feature a wide range of advanced technologies, including glass interposers with passives, silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. The planned capacity for this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per year. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF, automotive, photonics, and co-packaged optics.
Together, these projects are expected to generate hundreds of skilled jobs in Odisha and position Bhubaneswar as a strategic node in India’s semiconductor ecosystem. The move aligns with the Atmanirbhar Bharat initiative and marks a significant leap in India’s journey toward chip self-reliance.
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