In a major push to India’s semiconductor ambitions, the Union Cabinet has approved four new manufacturing projects under the India Semiconductor Mission (ISM), with a combined investment of ₹4,600 crore.
These projects—located in Odisha, Punjab, and Andhra Pradesh—are expected to generate over 2,000 skilled jobs and significantly enhance India’s capabilities in compound semiconductors and advanced packaging.
The approved companies include SiCSem and 3D Glass Solutions Inc. in Bhubaneswar, CDIL in Mohali, and ASIP Technologies in Andhra Pradesh. SiCSem, in collaboration with UK-based Clas-SiC Wafer Fab Ltd., will establish India’s first commercial Silicon Carbide (SiC) compound semiconductor fab. Meanwhile, 3D Glass Solutions will bring cutting-edge glass-based packaging technologies to India, including 3D Heterogeneous Integration modules.
CDIL’s expansion in Punjab will focus on high-power discrete devices like MOSFETs and IGBTs, while ASIP Technologies, in partnership with South Korea’s APACT Co. Ltd., will manufacture System-in-Package units for mobile and automotive applications.
These developments mark a significant leap in India’s journey toward self-reliance in semiconductor manufacturing, aligning with the Atmanirbhar Bharat initiative. With this, the total number of ISM-approved projects rises to ten, spanning six states and attracting cumulative investments of ₹1.6 lakh crore.
